 |
 |
- An Compound with all hydrogens replaced by fluorine on a carbon chain(CF4, C2F6 etc.) (from WIKIPEDIA)
- Including Semiconductor & LCD processing (Etching & CVD) gases (SF6, NF3)
- Very stable, Less harmful on body, Long detention period(SF6 : 3,200 years)
- Big influence on Global Warming |
|
 |
| Application |
Processes |
Gases |
Semiconductor &
LCD Panel processes |
Etching |
Vapor Etching |
HCl, HF, HBr, SF6, Cl2 |
Plasma Etching |
SiF4, CF4, C3F8, C2F6, CHF3, CClF3, O2 |
Ion Beam Etching |
C3F8, CHF3, CClF3, CF4 |
Cleaning |
NF3, CF4, C2F6, C3F8, SF6 |
CVD (Epitaxy)
|
SiH4, SiH2Cl2, SiHCl3, SiCl4, GeH4, B2H6, BBr3, BCl3,
AsH3,
PH3, TeH2, SnCl4, GeCl4, WF6. NH3, CH4, Cl2, MoF6
(Carrier Gas : High Purified H2, N2) |
| Photo-voltaic processes |
Etching |
NF3, CF4, C2F6, C3F8, SF6 |
|
|
|
 |
|
|
|
- Gas volume : 10~80 CMM (vary from processes and separations of exhaust gases)
- Temperature : 30~40℃
- Concentration of PFCs : 1,000~1,500 ppmV (LCD process)
- SiF4 + 2H2O → 4 HF + SiO2 (fine dust smaller than 5μm)
- High SiO2 in CVD
- SiO2 makes low destruction efficiency and increase maintenance costs
- Design Key Factor : SiO2 Dust, Mist removing with high efficiency |
|
※ Key Points to PFCs abatement system for Semiconductor & LCD gases
1) Minimize air volume by adequate separation of emission gas
2) Competitive initial costs
3) High efficiency in Pre-treatment system(stable against SiO2, Dust, Mist)
4) Maximize PFCs removal efficiency
5) Minimize operation and maintenance cost
|
|
|
|
|
|
Business Fields
